Global semiconductor : 2021 (Autumn) USB PD&Type-C Asia Exhibition

2021 (Autumn) USB PD&Type-C Asia Exhibition will be held as scheduled in Shenzhen Nanshan Science Park on November 26. As the high-profile annual consumer fast charging source industry exhibition in 2021, nearly 100 USB PD&Type-C industry chain companies gathered on the spot. This exhibition attracted a multi-professional audience to the scene and became relevant persons in the fast charging industry for face-to-face negotiations and technology A platform for communication, learning and growth.


环球半导体: 2021(秋季)USB PD&Type-C亚洲展

As the creator of high-performance digital power management chips, Global semiconductor has long been focusing on the R&D and design of high-quality power management ICs. At this exhibition, it also brought the latest PD fast charging source single-chip integrated solutions. At the scene, it was favored and recognized by all exhibiting partners on the scene, adding more wings to the application of PD fast charging technology in communication terminal products.

 

Activity site:

环球半导体: 2021(秋季)USB PD&Type-C亚洲展

环球半导体: 2021(秋季)USB PD&Type-C亚洲展

环球半导体: 2021(秋季)USB PD&Type-C亚洲展

 

Product scheme display:


环球半导体: 2021(秋季)USB PD&Type-C亚洲展

环球半导体: 2021(秋季)USB PD&Type-C亚洲展

环球半导体: 2021(秋季)USB PD&Type-C亚洲展

环球半导体: 2021(秋季)USB PD&Type-C亚洲展

At this exhibition, Global semiconductor launched the industry's first highly integrated PD power chip G1661D that meets the full-voltage requirements of PD fast charging. It adopts the unique patented technology of high-voltage process pioneered by the global semiconductor industry, and through high-efficiency super-junction power device drive control technology and high-power-density package integration, it achieves high efficiency, high reliability, high integration, and can meet customers' long-term And stable demand delivery.


Global semiconductor has long focused on the R&D and design of high-quality power management ICs, integrating advanced power management architecture design, semiconductor technology, and packaging technology to successfully develop multiple series of high-performance, high-power-density power chip products. Product technology is at the forefront of international power IC design. Global Semiconductor will continue to focus on customer needs, adhere to technological innovation, lead new technologies, high-density packaging technology, and persevere in reducing overall costs for users as its operating principles, and will soon launch a fast charging design with an integrated power of 45~65W Solution chip, stay tuned!


Finally, congratulations again on the complete success of the 2021 (Autumn) USB PD&Type-C Asia Expo!

 环球半导体: 2021(秋季)USB PD&Type-C亚洲展